The artificial intelligence chip war has spread to the packaging field.
It’s getting harder—both technically and financially—to make semiconductor chips smaller. The fight for chip tech supremacy has begun to migrate into a new area: how to package chips together to achieve better performance.
The rise of artificial intelligence will further boost demand for advanced packaging technologies—and create openings for challengers such as China to compensate for weaknesses in other parts of the supply chain.
The artificial intelligence chip war has spread to the packaging field. Read More »